邀请国际电子工业联接协会专家Jasbir Bath教学讲座
2013/04/25
2215
受电子封装技术专业田艳红教授邀请，IPC（国际电子工业联接协会）专家Jasbir Bath于4月27日(本周六)上午9:00，在材料楼322做关于无铅焊料、电子组装标准方面的教学讲座，题目为“Lead-free Solder”，欢迎相关专业师生参加。
IPC专家介绍：
Jasbir Bath Joins IPC as Principal Engineer
BANNOCKBURN, Ill., USA, October 5, 2012 — IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
As principal engineer, Bath will have responsibility for providing input and support for various IPC assembly technology standards as well as IPC’s International Technology Roadmap.
Jasbir has nearly 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. His experience, combined with his extensive knowledge of lead-free and tin-lead soldering technologies, makes Jasbir a welcome addition to our expert technical staff,” said Dave Torp, IPC vice president of standards and technology.
Bath began his engineering career as a technical officer at ITRI (formerly the International Tin Research Institute) in the United Kingdom. In 1998, he joined Flextronics International/Solectron Corporation as a lead engineer specializing in tin-lead and lead-free soldering materials, processes and components. In 2008, Bath formed his own consultancy firm, Bath and Associates Consultancy LLC, which provides process consulting and training services for the electronics manufacturing industry.
A contributor to four books on lead-free manufacturing, Bath has worked closely with IPC’s Solder Products Value Council (SPVC) to develop process and reliability data for Sn3Ag0.5Cu solder and served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit program. He holds B.S. and M.S. degrees in materials science from the University of Manchester/UMIST in England.
As principal engineer, Bath will have responsibility for providing input and support for various IPC assembly technology standards as well as IPC’s International Technology Roadmap.
Jasbir has nearly 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. His experience, combined with his extensive knowledge of lead-free and tin-lead soldering technologies, makes Jasbir a welcome addition to our expert technical staff,” said Dave Torp, IPC vice president of standards and technology.
Bath began his engineering career as a technical officer at ITRI (formerly the International Tin Research Institute) in the United Kingdom. In 1998, he joined Flextronics International/Solectron Corporation as a lead engineer specializing in tin-lead and lead-free soldering materials, processes and components. In 2008, Bath formed his own consultancy firm, Bath and Associates Consultancy LLC, which provides process consulting and training services for the electronics manufacturing industry.
A contributor to four books on lead-free manufacturing, Bath has worked closely with IPC’s Solder Products Value Council (SPVC) to develop process and reliability data for Sn3Ag0.5Cu solder and served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit program. He holds B.S. and M.S. degrees in materials science from the University of Manchester/UMIST in England.
材料科学与工程学院
2013年4月24日
